Altera package information

• forge
• Wednesday, July 26, 2023 3:31:39 PM
• 13 Comments

	File size: 7615 kB
	Views: 7573
	Downloads: 39
	Download links:
	Mirror link

Altera Device Package Information Data Sheet. Introduction. This data sheet provides package information for Altera® devices. It includes these sections:.Altera Device Package Information. 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.15 - D2:15.13.Issue 384162: Altera Device Package Information Data Sheet, Version 16.6 Pin A1 is missing for some of the 484-Pin FineLine Ball-Grid Array (FBGA) - Wire.Altera Device Package Information. 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.55 - D2:21.29.Altera Corporation. 93. Altera Device Package Information. 400-Pin Wirebond FineLine Ball-Grid Array (FBGA). □. All dimensions and tolerances conform to.Altera Device Package Data SheetIntel® FPGA Package and Thermal InformationAltera Device Package Information - Intel

October 2015 Altera Corporation. 04R-00493-1.0. Altera Device Package Information. 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip.April 2015 Altera Corporation. 04R-00488-1.0. Altera Device Package Information. 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip.This datasheet provides package and thermal resistance information for mature. Altera® devices. Package information includes the ordering code reference,.Table 7–1 shows which Altera® MAX II devices are available in thin quad flat pack. (TQFP), FineLine BGA (FBGA), and Micro Fineline BGA (MBGA) packages. Table 7–.October 2008 Altera Corporation. Cyclone III Device Handbook, Volume 1. 15. Package Information for Cyclone III. Devices. Introduction.Altera Device Package Information - IntelAltera Device Package Information Data SheetPackaging - Intel. juhD453gf

October 2011 Altera Corporation. 04R-00433-1.0. Altera Device Package Information. 324-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond.July 2011 Altera Corporation. 04R-00348-1.0. Altera Device Package Information. 256-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond.Altera Device Package Information. 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.70.April 2013 Altera Corporation. 04R-00453-2.0. Altera Device Package Information. 301-Pin Micro FineLine Ball-Grid Array (MBGA) - Copper.Altera Device Package Data Sheet - Glacier. READ. 192-Pin Ceramic Pin-Grid Array (PGA). Altera Device Package Information. □ All dimensions and tolerances.For more information on a specific package, refer to the Altera Device Package · Information Data Sheet. Table 71. Cyclone Maximum Output Clock Rate for Row.Table 6 lists socket vendor information for Altera BGA and. FineLine BGA packages. Note: (1) These socket recommendations may change due to package enhancements.Altera Corporation. Altera Device Package Information Data Sheet. Thermal. Resistance. Tables 2 through 9 provide θJA (junction-to-ambient thermal.July 2012 Altera Corporation. 04R-00447-2.0. Altera Device Package Information. 1760-Pin Hybrid FineLine Ball-Grid Array (HBGA) - Flip Chip.July 2012 Altera Corporation. 04R-00446-2.0. Altera Device Package Information. 1932-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Flat.Package Information includes the ordering code reference, packageacronym, leadframe material, lead finish (plating), JEDEC outline reference, leadcoplanarity,.March 2015 Altera Corporation. 04R-00476-2.0. Altera Device Package Information. 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond.Altera Device Package Information. 256-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.50. ▫ All dimensions and tolerances.Altera Device Package Information. 356-Pin Thermally Enhanced Ball-Grid Array (BGA) Cavity Down. □. All dimensions and tolerances conform to ANSI Y14.5M.July 2012 Altera Corporation. 04R-00448-2.0. Altera Device Package Information. 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA) - Flip Chip.The pins that are stated as Ejected Pins in the Altera® package information data sheets are the pins that are used to eject the device from the packaging.January 2011 Altera Corporation. 04R-00402-1.0. Altera Device Package Information. 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire.Altera Device Package Information. 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Thermal Composite - A:2.70 - D2:26.0.Altera Device Package Information. 356-Pin Ball-Grid Array (BGA). □ All dimensions and tolerances conform to ASME Y14.5M – 1994.Stratix III Device Packaging Information. This chapter provides thermal resistance values and package information for Altera®.September 2011 Altera Corporation. 04R-00427-1.0. Altera Device Package Information. 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond.July 2011 Altera Corporation. 04R-00385-1.0. Altera Device Package Information. 64-Pin Micro FineLine Ball-Grid Array (MBGA) - Wire Bond.January 2016 Altera Corporation. 04R-00461-5.0. Altera Device Package Information. 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip-.BGA and thermally enhanced Flip Chip FBGA package offerings. fFor more information, refer to Process Change Notice PCN0214. Table 25. Thermal Resistance. Altera.Altera Device Package Information 04R-00476-2.0 Package Outline 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.0 All dimensions.In these cases, the Altera Device Package Information Data Sheet provides accurate values and indicates which values are calculated.Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Alteraandreg; devices.July 2012 Altera Corporation. 04R-00443-3.0. Altera Device Package Information. 780-Pin Hybrid FineLine Ball-Grid Array (HBGA) - Flip Chip-.Package Information Datasheet for Altera Devices DS-PKG-16.5 This datasheet. The thermal resistance information includes device pin count, package name,.Altera Device Package Information. 780-Pin Hybrid FineLine Ball-Grid Array (HBGA) - Flip Chip - Channel Lid - A:3.40.June 2011 Altera Corporation. 04R-00391-1.0. Altera Device Package Information. 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA) - Flip Chip.Package Information Datasheet for Mature Altera Devices 3 Device and Package Cross Reference © December 2011 Altera Corporation Package.Altera Device Package Information 356-Pin Ball-Grid Array (BGA) □ □ □ All dimensions and tolerances conform to ASME Y14.5M – 1994.June 2011 Altera Corporation. 04R-00274-1.0. Altera Device Package Information. 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40.For the latest Arria II GX package drawings and thermal values, please go to the Altera Device Package Information Data Sheet (PDF).November 2012 Altera Corporation. 04R-00294-2.0. Altera Device Package Information. 1152-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip.An Altera® device is a 1517-Pin FineLine Ball-Grid Array (FBGA)-option 2-Flip Chip. refer to the Altera Device Package Information Datasheet (PDF).

• Altera package drawings
• Intel packages
• 256-lbga intel